DocumentCode
649537
Title
Single kernel electro-thermal IC simulator
Author
Raynaud, Philippe
Author_Institution
Mentor Graphics, Montbonnot Saint Martin, France
fYear
2013
fDate
25-27 Sept. 2013
Firstpage
356
Lastpage
358
Abstract
Electro-thermal effects - both at the micro level of interconnects and devices and at the macro level of circuits and systems - is one of the critical issues for the future development of microprocessors, integrated networks, and other highly integrated circuits and systems. Simulation-based solutions for both design and validation have an important role to play. This paper investigates a new, highly-accurate AND high-performing electro-thermal simulation method and tools. In this paper, we describe the extension of an analog electrical simulator to handle simultaneously the electrical network and the thermal network. These innovations remove the constraint on the time constants and allow accurate validation of the electro-thermal behavior for even the most advanced designs - in all possible conditions of stimuli, temperature, supply voltage, and process corners.
Keywords
circuit simulation; integrated circuit design; integrated circuit interconnections; analog electrical simulator; electrical network; electrothermal effects; highly-accurate-high-performing electrothermal simulation method; highly-integrated circuits; integrated networks; microprocessors; process corner; simulation-based solution; single-kernel electrothermal IC simulator; supply voltage; thermal network; time constants;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
Conference_Location
Berlin
Print_ISBN
978-1-4799-2271-0
Type
conf
DOI
10.1109/THERMINIC.2013.6675231
Filename
6675231
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