• DocumentCode
    649537
  • Title

    Single kernel electro-thermal IC simulator

  • Author

    Raynaud, Philippe

  • Author_Institution
    Mentor Graphics, Montbonnot Saint Martin, France
  • fYear
    2013
  • fDate
    25-27 Sept. 2013
  • Firstpage
    356
  • Lastpage
    358
  • Abstract
    Electro-thermal effects - both at the micro level of interconnects and devices and at the macro level of circuits and systems - is one of the critical issues for the future development of microprocessors, integrated networks, and other highly integrated circuits and systems. Simulation-based solutions for both design and validation have an important role to play. This paper investigates a new, highly-accurate AND high-performing electro-thermal simulation method and tools. In this paper, we describe the extension of an analog electrical simulator to handle simultaneously the electrical network and the thermal network. These innovations remove the constraint on the time constants and allow accurate validation of the electro-thermal behavior for even the most advanced designs - in all possible conditions of stimuli, temperature, supply voltage, and process corners.
  • Keywords
    circuit simulation; integrated circuit design; integrated circuit interconnections; analog electrical simulator; electrical network; electrothermal effects; highly-accurate-high-performing electrothermal simulation method; highly-integrated circuits; integrated networks; microprocessors; process corner; simulation-based solution; single-kernel electrothermal IC simulator; supply voltage; thermal network; time constants;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4799-2271-0
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2013.6675231
  • Filename
    6675231