DocumentCode :
650010
Title :
Methodology for thermal diffusivity determination of metallic films at room temperature
Author :
Lugo, J.M. ; Corona, J.E. ; Oliva, A.I.
Author_Institution :
Dept. of Fis. Aplic., Centro de Investig. y de Estudios Av. del IPN, Merida, Mexico
fYear :
2013
fDate :
Sept. 30 2013-Oct. 4 2013
Firstpage :
375
Lastpage :
379
Abstract :
An analytical model and a methodology for thermal diffusivity determination of metallic thin films at atmospheric pressure and room temperature are discussed. The analytical model is based on the one-dimensional heat conduction equation which allows us to estimate the thermal diffusivity value through the initial heating slope. To determine the thermal diffusivity value of metallic nanofilms, controlled micropulses were applied on them in order to measure changes in the electrical resistance and to estimate the corresponding changes of temperature in the transitory regime, where only the metallic film is heated. The proposed analytical model and the methodology were used to characterize Au and Al thin films thermally deposited on glass substrates. Preliminary results gave thermal diffusivity values of (40 ± 4) × 10-6 m2/s for an Au(40 nm) film, and (25 ± 3) ±10-6 m2/s for an Al(40 nm) film at room conditions (298 K, and atmospheric pressure).
Keywords :
aluminium; electric resistance; gold; metallic thin films; nanostructured materials; thermal diffusivity; 1D heat conduction equation; Al; Al thin film; Au; Au thin film; analytical model; controlled micropulses; electrical resistance; glass substrates; initial heating slope; metallic nanofilms; metallic thin films; pressure 1 atm; size 40 nm; temperature 293 K to 298 K; temperature changes; thermal diffusivity determination; transitory regime; metallic film; micropulse; temperature profile; thermal diffusivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Engineering, Computing Science and Automatic Control (CCE), 2013 10th International Conference on
Conference_Location :
Mexico City
Print_ISBN :
978-1-4799-1460-9
Type :
conf
DOI :
10.1109/ICEEE.2013.6676041
Filename :
6676041
Link To Document :
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