Title :
Development of Multi-Chip Module-D technology-testchip
Author :
Freitas, Wilson ; Flacker, Alexander ; Adamo, Cristina B. ; Rotondaro, Antonio L. P.
Author_Institution :
Renato Archer Center for Inf. Technol., Campinas, Brazil
Abstract :
Multi-Chip Modules enable combining different integrated circuits with passive components leading to advantages in size, performance and cost. This paper presents the design of a testchip which was planned to extend the characterization of the process parameters for the development of MCM-D technology. It was made using Virtuoso Cadence Software, with minimum dimension of 20 μm, resulting in four mask layers.
Keywords :
electronic engineering computing; integrated circuit packaging; multichip modules; MCM-D technology; Virtuoso Cadence Software; integrated circuit; multichip module-D technology-testchip; passive component; Multi-Chip module; passive components; photomask; testchip;
Conference_Titel :
Microelectronics Technology and Devices (SBMicro), 2013 Symposium on
Conference_Location :
Curitiba
Print_ISBN :
978-1-4799-0516-4
DOI :
10.1109/SBMicro.2013.6676126
