• DocumentCode
    650094
  • Title

    Development of Multi-Chip Module-D technology-testchip

  • Author

    Freitas, Wilson ; Flacker, Alexander ; Adamo, Cristina B. ; Rotondaro, Antonio L. P.

  • Author_Institution
    Renato Archer Center for Inf. Technol., Campinas, Brazil
  • fYear
    2013
  • fDate
    2-6 Sept. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Multi-Chip Modules enable combining different integrated circuits with passive components leading to advantages in size, performance and cost. This paper presents the design of a testchip which was planned to extend the characterization of the process parameters for the development of MCM-D technology. It was made using Virtuoso Cadence Software, with minimum dimension of 20 μm, resulting in four mask layers.
  • Keywords
    electronic engineering computing; integrated circuit packaging; multichip modules; MCM-D technology; Virtuoso Cadence Software; integrated circuit; multichip module-D technology-testchip; passive component; Multi-Chip module; passive components; photomask; testchip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics Technology and Devices (SBMicro), 2013 Symposium on
  • Conference_Location
    Curitiba
  • Print_ISBN
    978-1-4799-0516-4
  • Type

    conf

  • DOI
    10.1109/SBMicro.2013.6676126
  • Filename
    6676126
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=650094