DocumentCode
650103
Title
RTP silicon oxynitrides to fabricate MOS tunnel diodes
Author
Christiano, V. ; dos Santos Filho, S.G.
Author_Institution
Univ. of Sao Paulo: LSI/PSI/EPUSP, Sao Paulo, Brazil
fYear
2013
fDate
2-6 Sept. 2013
Firstpage
1
Lastpage
4
Abstract
Oxide layers with thickness varying from 1 to 2.4 nm, were obtained at 700 and 850°C, in a mixed ambient of nitrogen and oxygen. Thicker layers were also grown at 1150°C in the mixed ambient, or just in oxygen, using a conventional thermal furnace adapted for a rapid thermal processing (RTP).
Keywords
MIS devices; oxidation; rapid thermal processing; silicon compounds; tunnel diodes; MOS tunnel diodes fabrication; RTP; oxide layers; rapid thermal processing; silicon oxynitrides; temperature 1150 C; temperature 700 C; temperature 850 C; thermal furnace; Oxynitrides; RTP; SiON; Temperature profiling;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics Technology and Devices (SBMicro), 2013 Symposium on
Conference_Location
Curitiba
Print_ISBN
978-1-4799-0516-4
Type
conf
DOI
10.1109/SBMicro.2013.6676135
Filename
6676135
Link To Document