Ultra-thin Si chips for flexible electronics Process technology, characterization, assembly and applications

Author

Burghartz, Joachim N. ; Angelopoulos, E. ; Appel, W. ; Endler, S. ; Ferwana, S. ; Harendt, Christine ; Hassan, M.-U. ; Rempp, Horst ; Richter, H. ; Zimmermann, M.

Author_Institution

Inst. for Microelectron. Stuttgart (IMS CHIPS), Stuttgart, Germany

fYear

2013

fDate

2-6 Sept. 2013

Firstpage

1

Lastpage

3

Abstract

Various aspects of ultra-thin chip technology for flexible electronics are presented and discussed, including ultra-thin-chip fabrication, mechanical and electrical characterization, as well as chip assembly and imbedding. A stress sensor based on a stack of two ultra-thin, flexible CMOS chips indicates the particular advantages of the Chipfilm™ process technology, which is subject of this paper, when compared to other kinds of thin-chip fabrication.

Keywords

CMOS integrated circuits; assembling; elemental semiconductors; flexible electronics; integrated circuit packaging; silicon; stress effects; Chipfilm process technology; Si; chip assembly; electrical characterization; flexible electronics; mechanical characterization; stress sensor; ultra-thin chip technology; ultra-thin flexible CMOS chips; ultra-thin-chip fabrication; chip stacking; mechanical stability; piezoresistive effect; process window; thin chips; thin-chip fabrication; warpage;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics Technology and Devices (SBMicro), 2013 Symposium on

Conference_Location

Curitiba

Print_ISBN

978-1-4799-0516-4

Type

conf

DOI

10.1109/SBMicro.2013.6676182

Filename

6676182