• DocumentCode
    651337
  • Title

    Deployment of vendor innovation capability in contract electronic manufacturing

  • Author

    Auramo, Jaana ; Mefford, Robert N.

  • Author_Institution
    DTU Executive Sch. of Bus., Tech. Univ. of Denmark, Lyngby, Denmark
  • fYear
    2012
  • fDate
    8-9 Nov. 2012
  • Firstpage
    56
  • Lastpage
    60
  • Abstract
    This paper explores deployment of innovation capability in outsourcing from the vendor perspective. Vendor´s innovation-related competences are used to capture vendor innovativeness. A multiple-case study was applied with two Contract Electronic Manufacturers. Based on the data analysis we propose a model for calculating a vendor´s innovation potential measured by the deployment effect of innovation-related competences. The model suggests that a vendor´s innovation potential will be higher if it fosters innovation capability as a distinctive competitive advantage than if it develops innovation capability as an adjunct to other capabilities.
  • Keywords
    electron device manufacture; innovation management; contract electronic manufacturers; contract electronic manufacturing; data analysis; vendor innovation capability deployment; vendor innovation-related competence; vendor innovativeness; Innovation Capability; Manufacturing Capabilities; Resource-based View; Vendor Perspective;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Technology (ISMOT), 2012 International Symposium on
  • Conference_Location
    Hangzhou
  • Type

    conf

  • DOI
    10.1109/ISMOT.2012.6679428
  • Filename
    6679428