• DocumentCode
    65312
  • Title

    Basic Aspects of High-Power Semiconductor Laser Simulation

  • Author

    Wenzel, Hans

  • Author_Institution
    Ferdinand-Braun-Inst., Leibniz-Inst. fur Hochstfrequenztechnik, Berlin, Germany
  • Volume
    19
  • Issue
    5
  • fYear
    2013
  • fDate
    Sept.-Oct. 2013
  • Firstpage
    1
  • Lastpage
    13
  • Abstract
    The aim of this paper is to review some of the models and solution techniques used in the simulation of high-power semiconductor lasers and to address open questions. We discuss some of the peculiarities in the description of the optical field of wide-aperture lasers. As an example, the role of the substrate as a competing waveguide in GaAs-based lasers is studied. The governing equations for the investigation of modal instabilities and filamentation effects are presented and the impact of the thermal-lensing effect on the spatiotemporal behavior of the optical field is demonstrated. We reveal the factors that limit the output power at very high injection currents based on a numerical solution of the thermodynamic based drift-diffusion equations and elucidate the role of longitudinal spatial hole burning.
  • Keywords
    III-V semiconductors; chemical interdiffusion; gallium arsenide; optical hole burning; optical waveguides; semiconductor lasers; thermal lensing; thermodynamics; GaAs; drift-diffusion equations; high-power semiconductor laser; injection currents; modal filamentation; modal instabilities; optical field; optical waveguide; spatial hole burning; spatiotemporal behavior; thermal-lensing effect; thermodynamic; wide-aperture lasers; Cavity resonators; Indexes; Laser modes; Mathematical model; Optical waveguides; Substrates; Waveguide lasers; Diode lasers; laser modes; laser theory; numerical simulation; semiconductor device modeling; semiconductor lasers;
  • fLanguage
    English
  • Journal_Title
    Selected Topics in Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    1077-260X
  • Type

    jour

  • DOI
    10.1109/JSTQE.2013.2246774
  • Filename
    6468062