DocumentCode
653145
Title
Power Management for High-Performance Applications on Network-on-Chip-Based Multiprocessors
Author
Kohler, A. ; Radetzki, Martin
Author_Institution
Inst. of Comput. Archit. & Comput. Eng., Univ. of Stuttgart, Stuttgart, Germany
fYear
2013
fDate
20-23 Aug. 2013
Firstpage
77
Lastpage
85
Abstract
Since the end of the Megahertz Race, the main factor in improving processor performance has been the increase of the number of cores integrated on a single chip. While four-, six- and eight-core processors are standard today, future designs with even higher core counts encounter scalability problems concerning the on-chip interconnect and power dissipation. For the interconnect problem, regular tile-based designs that employ a Network-on-Chip to provide inter-core connectivity have been proposed as solution. To mitigate the power consumption issue, we present a system for exploiting idle time in high-performance applications by reducing a core´s frequency, thus saving power without affecting performance. The system relies on annotation of synchronizing communication calls and has been shown to reduce the energy requirements of considered applications by 20-30%, while introducing negligible overhead in terms of runtime.
Keywords
integrated circuit design; integrated circuit interconnections; multiprocessing systems; multiprocessor interconnection networks; network-on-chip; power aware computing; Megahertz Race; communication call synchronisation; high-performance applications; inter-core connectivity; network-on-chip-based multiprocessors; on-chip interconnect; power consumption mitigation; power dissipation; power management; regular tile-based designs; scalability problems; Hardware; Memory management; Multicore processing; Random access memory; System-on-chip; Time-frequency analysis; Many-core processors; Message-passing; Network-on-Chip; Power management;
fLanguage
English
Publisher
ieee
Conference_Titel
Green Computing and Communications (GreenCom), 2013 IEEE and Internet of Things (iThings/CPSCom), IEEE International Conference on and IEEE Cyber, Physical and Social Computing
Conference_Location
Beijing
Type
conf
DOI
10.1109/GreenCom-iThings-CPSCom.2013.38
Filename
6682052
Link To Document