• DocumentCode
    653634
  • Title

    Study of high brightness LED samples aged under stress temperature conditions: Electrical characterizations and signature evolution analysis

  • Author

    Canale, Laurent ; Dupuis, Paul ; Zissis, Georges

  • Author_Institution
    LAPLACE Lab., Paul Sabatier Univ., Toulouse, France
  • fYear
    2013
  • fDate
    6-11 Oct. 2013
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    LED devices used in lighting or backlighting applications are expected to be stable with a long life time. Manufacturers are thus interested in early detection of well-know degradation mechanisms and relationship between electrical signature evolutions and aging in order to predict the end of life of LED devices. This report presents electrical analysis results of four kind of high power LEDs through accelerated aging under temperature stress conditions. The first part of this paper describes the device, the aging protocol used, and the thermal measurements performed to improve and/or quantify the homogeneity. In the second part, I-V and C-V electric characterizations are described using methods to avoid capacitance or temperature warm-ups artifacts. Aging signature of Nichia and thermal influence on I-V measurements of Bridgelux BXRA-W3500 are presented.
  • Keywords
    life testing; light emitting diodes; lighting; temperature measurement; thermal stresses; Bridgelux BXRA-W3500; LED devices; LED lighting; accelerated aging; degradation mechanisms; electrical characterizations; electrical signature evolutions; temperature stress; thermal influence; thermal measurements; Acceleration; Energy measurement; Heating; Light emitting diodes; Monitoring; Plasma measurements; Voltage measurement; accelerated aging; aging; backlighting; capacitance-voltage characteristics; current-voltage characteristics; display; electroluminescent devices; light emitting diodes; light sources;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting, 2013 IEEE
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0197-2618
  • Type

    conf

  • DOI
    10.1109/IAS.2013.6682543
  • Filename
    6682543