• DocumentCode
    654664
  • Title

    Millimeter- and submillimeter-wave monolithic integrated circuits based on metamorphic HEMT technology for sensors and communication

  • Author

    Schlechtweg, Michael ; Tessmann, A. ; Leuther, A. ; Massler, Hermann ; Wagner, Steffen ; Aidam, R. ; Rosenzweig, J. ; Ambacher, Oliver ; Kallfass, I. ; Lewark, U.J. ; Sommer, Rainer ; Wahlen, Alfred ; Stanko, Stephan ; Ender, Joachim

  • Author_Institution
    Fraunhofer Inst. for Appl. Solid State Phys. IAF, Freiburg, Germany
  • fYear
    2013
  • fDate
    21-23 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    For the next generation of sensors and communication systems operating at frequencies up to 600 GHz and above, the Fraunhofer IAF is developing a broad variety of millimeter- and submillimeter-wave monolithic integrated circuits (MMICs and S-MMICs) and modules. The monolithic integrated circuits are realized using the advanced metamorphic high electron mobility transistor (mHEMT) technology in the InGaAs/InAlAs material system on 4” GaAs substrates. This paper presents a 600 GHz amplifier S-MMIC and a chip set of MMICs developed for a 300 GHz radar.
  • Keywords
    III-V semiconductors; MMIC amplifiers; aluminium compounds; gallium arsenide; high electron mobility transistors; indium compounds; millimetre wave radar; submillimetre wave amplifiers; Fraunhofer IAF; GaAs; InGaAs-InAlAs; amplifier S-MMIC; frequency 300 GHz; frequency 600 GHz; mHEMT technology; metamorphic high electron mobility transistor; millimeter-wave MMIC; radar; size 4 in; submillimeter-wave monolithic integrated circuits; Indium phosphide; Logic gates; MMICs; MODFETs; Radar; mHEMTs; metamorphic high electron mobility transistor (mHEMT); millimeter-wave monolithic integrated circuit (MMIC); mixer; multiplier; radar; submillimeter-wave monolithic integrated circuit (S-MMIC) amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwaves, Communications, Antennas and Electronics Systems (COMCAS), 2013 IEEE International Conference on
  • Conference_Location
    Tel Aviv
  • Type

    conf

  • DOI
    10.1109/COMCAS.2013.6685251
  • Filename
    6685251