Broadband interconnect design for silicon-based system-in-package applications up to 170 GHz

Author

Topak, Eray ; Joo-Young Choi ; Merkle, Thomas ; Koch, Stephan ; Saito, Sakuyoshi ; Landesberger, Christof ; Faul, Robert ; Bock, Karlheinz

Author_Institution

Sensing Syst. Lab., Sony Deutschland GmbH, Stuttgart, Germany

fYear

2013

fDate

6-10 Oct. 2013

Firstpage

116

Lastpage

119

Abstract

This paper presents the design of vertical chip-to-chip interconnects for mm-wave system-in-package (SiP) applications up to 170 GHz. Solid and liquid type polymer materials are used as the interlayer dielectric on the structured Si-wafers to realize coplanar waveguide (CPW) interconnects. Coplanar transmission lines fabricated on high- and low-resistivity silicon substrates are tested and their characteristics are compared, as well. The interconnect structures show excellent electrical performance from DC up to 170 GHz with an insertion loss of 0.6 dB per transition at 170 GHz.

Keywords

coplanar waveguides; elemental semiconductors; integrated circuit interconnections; millimetre wave integrated circuits; silicon; system-in-package; broadband interconnect design; coplanar transmission lines; coplanar waveguide interconnects; frequency 170 GHz; interlayer dielectric; liquid type polymer materials; mm wave system in package; silicon based system in package applications; solid type polymer materials; structured wafers; vertical chip to chip interconnects; Gold; MMICs; Packaging; Silicon; Substrates; Millimeter wave devices; millimeter-wave integrated circuits; packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference (EuMC), 2013 European

Conference_Location

Nuremberg

Type

conf

Filename

6686604