Title :
Impact of the packaging technology on a SiGe:C Ku-band low noise converter for satellite reception
Author :
Gamand, P. ; Tesson, O.
Author_Institution :
NXP Semicond., Caen, France
Abstract :
This paper demonstrates the benefits of co-designing microwave IC´s in advanced Fan-Out-Package. This concept has been employed on a fully integrated Low Noise Receiver for Satellite TV application realized in a SiGe:C BiCMOS technology. Matching, attenuation, conversion gain, coupling and noise figure (NF) characteristics of the full packaged circuit are strongly improved with respect to conventional solution based on HVQFN packages. In particular, by using a co-design package-circuit methodology we have been able to reduce the overall noise figure of the down-converter by 2.5 dB in the Ku-band frequency range. The complete product exhibits 6 dB of NF associating with 46 dB of gain. The phase noise is as low as -117 dBc/Hz at 10 MHz offset from the LO frequency of 10.6 GHz. This approach clearly outperforms down-bond based solutions in conventional plastic package and should definitely be considered for high performance low cost microwave and millimeter wave applications.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; direct broadcasting by satellite; integrated circuit noise; integrated circuit packaging; phase noise; television broadcasting; BiCMOS technology; HVQFN packages; Ku-band low noise converter; SiGe:C; co-designing microwave IC; codesign package-circuit methodology; conventional plastic package; conventional solution; down-bond based solutions; down-converter; fan-out-package; frequency 10 MHz; frequency 10.6 MHz; frequency range; full packaged circuit are; gain 46 dB; integrated low noise receiver; microwave application; millimeter wave application; noise figure; noise figure 6 dB; packaging technology; phase noise; satellite TV application; satellite reception; Couplings; Gain; Integrated circuit modeling; Microwave circuits; Noise figure; BiCMOS technology; Low-Noise Block (LNB); co-design; microwave; packaging;
Conference_Titel :
Microwave Conference (EuMC), 2013 European
Conference_Location :
Nuremberg
