Development of new technologies using foam materials for RF device integration

This paper deals with results concerning the development of new innovative and competitive technologies for RF device integration, especially hybrid technologies using plastic foam materials. In addition to their relative transparency to microwave signal propagation, these materials have a lot of very interesting properties: weight, cost, ability to be shaped or moulded, ability to be used as a mechanical support as well as a propagation medium. Moreover, these materials have remarkable intrinsic properties in terms of physical, mechanical, thermal and chemical properties. In this context, it is essential to have a good knowledge and an advanced process control of these technologies in order to be best able to satisfy the RF device integration requirements. This paper presents the technological process and performances of microwave devices using foam materials, such as waveguide and printed structures.