High-frequency modeling of metal fill eddy-current loss in integrated circuits

Author

Gaskill, Steven G. ; Shilimkar, Vikas S. ; Weisshaar, Andreas

Author_Institution

Sch. of Electr. Eng. & Comput. Sci., Oregon State Univ., Corvallis, OR, USA

fYear

2013

fDate

6-10 Oct. 2013

Firstpage

975

Lastpage

978

Abstract

This paper presents a fast basis-function-based table lookup approach to account for the eddy current losses due to metal fill in spatially varying magnetic fields. This approach enables the accurate prediction of the change in resistance and inductance due to metal fill in close proximity to interconnects, spiral inductors, and other passive components over a wide range of frequencies and dimensions. The approach is compared to the simulation of a 50Ω on-chip microstrip transmission line with surrounding 50% density metal fill. Our method captures the change in resistance with less than 2% error at 100 GHz.

Keywords

MMIC; eddy current losses; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; microstrip lines; fast basis function; frequency 100 GHz; high frequency modeling; inductance change; integrated circuit interconnect; metal fill eddy current loss; on chip microstrip transmission line; passive components; resistance 50 ohm; resistance change; spatially varying magnetic field; spiral inductors; table lookup; Eddy currents; Integrated circuit interconnections; Integrated circuit modeling; Metals; Microstrip; Resistance; Vectors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference (EuMC), 2013 European

Conference_Location

Nuremberg

Type

conf

Filename

6686822