DocumentCode :
656072
Title :
Temperature tuning of band edge resonant modes in one-dimensional photonic crystals
Author :
Kee-Choon Yeong ; Kim-Ho Yeap ; Chee-Leong Lee ; Lai-Kuan Yik
Author_Institution :
Dept. of Electron. Eng., Tunku Abdul Rahman Univ., Kampar, Malaysia
fYear :
2013
fDate :
28-30 Oct. 2013
Firstpage :
126
Lastpage :
128
Abstract :
The transmission characteristics of Si-based 1D photonic crystals was investigated using transfer matrix method. As the temperature and wavelength dependence of Si refractive index induces band edge resonant modes that are temperature tunable, the average wavelength shift per Kelvin of the resonant mode with the largest group index was determined in the vicinity of the band edge. A general linear chirp structure consisting of a constant and chirp component was implemented. Using the simulated annealing algorithm, the structural parameters were optimized and it was found that the average wavelength shift per Kelvin of the band edge resonant mode can be enhanced by 28.9% with high transmission. It was also found that spatial chirping does not affect the wavelength shift. The enhancement was achieved by a uniform increase of PC layer widths. Tunable band edge resonant modes may be exploited in designing optical thermal sensing devices.
Keywords :
chirp modulation; elemental semiconductors; photonic crystals; refractive index; silicon; simulated annealing; Si; Si refractive index; Si-based 1D photonic crystals; band edge resonant modes; general linear chirp structure; group index; one-dimensional photonic crystals; simulated annealing; spatial chirping; temperature dependence; temperature tuning; transfer matrix method; transmission characteristics; wavelength dependence; Chirp; Photonics; Simulated annealing; Slow light; One-dimensional photonic crystal; chirping; group index; sensor; transfer matrix method;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photonics (ICP), 2013 IEEE 4th International Conference on
Conference_Location :
Melaka
Print_ISBN :
978-1-4673-6073-9
Type :
conf
DOI :
10.1109/ICP.2013.6687089
Filename :
6687089
Link To Document :
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