DocumentCode :
656574
Title :
Signal generation and amplification up to 600 GHz using metamorphic HEMT technology
Author :
Lewark, U.J. ; Tessmann, A. ; Leuther, A. ; Zwick, T. ; Ambacher, Oliver ; Kallfass, I.
Author_Institution :
Inst. fur Hochfrequenztech. und Elektron. (IHE), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
fYear :
2013
fDate :
6-8 Oct. 2013
Firstpage :
125
Lastpage :
128
Abstract :
In this paper, we present an overview of advanced millimeter-wave and submillimeter-wave monolithic integrated circuits for applications around 600 GHz, recently realized using our 35 nm InAlAs/InGaAs based depletion-type metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar circuit topology (GCPW) with a reduced ground-to-ground spacing. A frequency multiplier-by-six is presented for signal generation and a terahertz monolithic integrated circuit (TMIC) is shown, offering a small-signal gain of more than grounded coplanar circuit topology 18 dB between 557 and 616 GHz.
Keywords :
III-V semiconductors; aluminium compounds; field effect MIMIC; frequency multipliers; gallium arsenide; high electron mobility transistors; indium compounds; millimetre wave frequency convertors; millimetre wave generation; submillimetre wave generation; submillimetre wave integrated circuits; GCPW; InAlAs-InGaAs; TMIC; advanced millimeter-wave monolithic integrated circuits; depletion-type metamorphic high electron mobility transistor; frequency 557 GHz to 616 GHz; frequency multiplier-by-six; grounded coplanar circuit topology; metamorphic HEMT technology; reduced ground-to-ground spacing; signal amplification; signal generation; size 35 nm; small-signal gain; submillimeter-wave monolithic integrated circuits; terahertz monolithic integrated circuit; Frequency measurement; Logic gates; MMICs; Power amplifiers; Power generation; mHEMTs; amplifier; frequency-multiplier; submillimeter-wave monolithic integrated circuit (S-MMIC); terahertz monolithic integrated circuit (TMIC);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Integrated Circuits Conference (EuMIC), 2013 European
Conference_Location :
Nuremberg
Type :
conf
Filename :
6687801
Link To Document :
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