• DocumentCode
    656831
  • Title

    Wafer bonding for vacuum encapsulated MEMS

  • Author

    Dragoi, Viorel ; Pawlak, M. ; Flotgen, C. ; Mittendorfer, G. ; Pabo, E.

  • Author_Institution
    EV Group, St. Florian, Austria
  • Volume
    1
  • fYear
    2013
  • fDate
    14-16 Oct. 2013
  • Firstpage
    17
  • Lastpage
    20
  • Abstract
    The working principle of various categories of MEMS devices require inside the packages the encapsulation of vacuum ambient which impacts on device performance. The factors impacting on process choice will be reviewed. Main wafer bonding processes used for such applications will be introduced.
  • Keywords
    encapsulation; micromechanical devices; wafer bonding; MEMS device; vacuum encapsulation; wafer bonding process; Bonding; Cavity resonators; Gettering; Glass; Micromechanical devices; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference (CAS), 2013 International
  • Conference_Location
    Sinaia
  • ISSN
    1545-827X
  • Print_ISBN
    978-1-4673-5670-1
  • Electronic_ISBN
    1545-827X
  • Type

    conf

  • DOI
    10.1109/SMICND.2013.6688075
  • Filename
    6688075
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=656831