Title :
Integrated MEMS by adhesive bonding
Author :
Esashi, Masayoshi ; Tanaka, Shoji
Author_Institution :
World Premier Int. Res. Center Adv., Tohoku Univ., Sendai, Japan
Abstract :
Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. MEMS devices of films formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to resonator, piezoelectric switch, tactile sensor, electron source. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.
Keywords :
adhesive bonding; electron sources; large scale integration; microswitches; piezoelectric devices; resonators; tactile sensors; wafer level packaging; MEMS devices; carrier wafer; device transfer process; electron source; film transfer process; heterogeneous components; heterogeneous integration; integrated MEMS; microsystems; multiple LSI wafers; piezoelectric switch; resonator; selective bonding; tactile sensor; wafer level adhesive bonding; Bonding; Films; Large scale integration; Micromechanical devices; Microswitches; Tactile sensors;
Conference_Titel :
SENSORS, 2013 IEEE
Conference_Location :
Baltimore, MD
DOI :
10.1109/ICSENS.2013.6688122
