DocumentCode :
656902
Title :
A sensitive three-axis micromachined accelerometer based on an electrostatically suspended proof mass
Author :
Fengtian Han ; Boqian Sun ; Linlin Li ; Gaoyin Ma
Author_Institution :
Dept. of Precision Instrum., Tsinghua Univ., Beijing, China
fYear :
2013
fDate :
3-6 Nov. 2013
Firstpage :
1
Lastpage :
4
Abstract :
A three-axis micromachined accelerometer where a free proof mass is suspended electrostatically in six degrees of freedom is proposed and tested in order to evaluate this sensitive electrostatic accelerometer for potential microgravity space applications. The micromachined device is based on a novel glass/silicon/glass bonding structure, fabricated by bulk micromachining technique and operated with closed-loop forcefeedback technology. The motion of the proof mass with respect to each side is fully servo-controlled by capacitive position sensing and electrostatic force feedback. To facilitate ground test of this low-g accelerometer, the full input range in the vertical z axis is set at a relatively high value of 3.68g in order to counteract the gravity in one g condition, while the range in the lateral x axis is set as low as 2.90mg to achieve high sensitivity. Initial test of this MEMS accelerometer shows that a sensitivity of 688.8V/g is achieved by setting a low bias voltage of 1V.
Keywords :
accelerometers; bonding processes; capacitive sensors; electrostatic devices; elemental semiconductors; feedback; force measurement; force sensors; glass; micromachining; microsensors; position measurement; silicon; silicon compounds; zero gravity experiments; MEMS accelerometer; SiO2-Si-SiO2; capacitive position sensor; closed-loop force-feedback technology; electrostatic accelerometer; electrostatic force feedback; electrostatically suspended proof mass; glass-silicon-glass bonding structure; mass 3.68 g; microgravity space application; sensitive three-axis micromachined accelerometer; voltage 1 V; Accelerometers; Electrodes; Electrostatics; Glass; Sensors; Suspensions; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SENSORS, 2013 IEEE
Conference_Location :
Baltimore, MD
ISSN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2013.6688167
Filename :
6688167
Link To Document :
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