• DocumentCode
    657110
  • Title

    A differential resonant barometric pressure sensor using SOI-MEMS technology

  • Author

    Zhenyu Luo ; Deyong Chen ; Junbo Wang ; Jian Chen

  • Author_Institution
    State Key Lab. of Transducer Technol., Inst. of Electron., Beijing, China
  • fYear
    2013
  • fDate
    3-6 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a resonant barometric pressure sensor based on SOI-MEMS technology. In this device, pressure under measurement causes a deflection of a pressure-sensitive silicon square diaphragm, which is further translated to stress build up in “H” type doubly-clamped micro beams, leading to resonant frequency shift. In device fabrication, SOI-MEMS fabrication processes were utilized, where a new modified buffered hydrofluoric acid (BHF) solution was used to remove the buried oxide layer and release the suspended resonant beams. Experimental results recorded a device resolution of 10Pa, with the nonlinearity of 0.03%, and the temperature coefficient of -0.04% F.S/°C in the range of -40°C to 30°C. The long-term stability error of the proposed device was quantified as 0.05% F.S over the past 3 months.
  • Keywords
    atmospheric pressure; diaphragms; elemental semiconductors; microfabrication; micromechanical resonators; microsensors; organic compounds; pressure measurement; pressure sensors; silicon; silicon-on-insulator; H type doubly clamped microbeam; SOI-MEMS fabrication process; buffered hydrofluoric acid; device fabrication; differential resonant barometric pressure sensor; pressure measurement; pressure sensitive silicon square diaphragm deflection; resonant frequency shift; stability error; suspended resonant beam; temperature coefficient; Electrodes; Fabrication; Gold; Resonant frequency; Silicon; Stress; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2013 IEEE
  • Conference_Location
    Baltimore, MD
  • ISSN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2013.6688394
  • Filename
    6688394