A lateral-axis MEMS tuning fork gyroscope with nozzle-optimized squeeze-film sensing element

Author

Minghao Nie ; Dachuan Liu ; Liguo Dong ; Qiancheng Zhao ; Zhenchuan Yang ; Guizhen Yan

Author_Institution

Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China

fYear

2013

fDate

3-6 Nov. 2013

Firstpage

1

Lastpage

4

Abstract

This paper presents a lateral-axis MEMS tuning-fork gyroscope with nozzle-optimized squeeze-film sensing element fabricated using silicon-on-glass process. The proposed nozzle-optimized sensing element is able to provide large capacitive output which is beneficial for mode-splitting design, while it is also compatible with standard 3-masks silicon-on-glass process without any increasing of fabrication complexity. The fabricated gyroscope was vacuum-packaged to ~100Pa and then mounted on an analog PCB for close-loop drive and pickoff read-out. The measured sensitivity was 9.1 mV/(°/s) while the non-linearity is 0.913% with the full scale of 1000°/s. The tested noise floor is 0.02°/s /Hz^1/2.

Keywords

elemental semiconductors; glass; gyroscopes; microsensors; printed circuits; semiconductor device noise; semiconductor device packaging; silicon; silicon-on-insulator; vibrations; 3-masks silicon-on-glass process; Si-SiO₂; analog PCB; capacitive output; close-loop drive; fabrication complexity; lateral-axis MEMS tuning fork gyroscope; mode-splitting design; noise floor; nozzle-optimized squeeze-film sensing element; pickoff read-out; vacuum-packaging; Electrodes; Fabrication; Force; Gyroscopes; Micromechanical devices; Sensitivity; Sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

SENSORS, 2013 IEEE

Conference_Location

Baltimore, MD

ISSN

1930-0395

Type

conf

DOI

10.1109/ICSENS.2013.6688402

Filename

6688402