• DocumentCode
    657218
  • Title

    Polycrystalline diamond circular resonant diaphragms with low onset of nonlinear response

  • Author

    Barnes, A.C. ; Zorman, C.A.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
  • fYear
    2013
  • fDate
    3-6 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we report the results of an initial study to characterize the resonance behavior of ultra-thin, large area, circular polycrystalline diamond diaphragms as a potential structural material for resonant sensors. The resonant response of the diaphragms fabricated on Si substrates was measured for excitation frequencies from the low kHz to 1 MHz. Due to the large aspect ratio, a high Young´s modulus and high quality factors, resonances enter the nonlinear Duffing regime at very low drive voltages. This nonlinear behavior is known for its use in parametric excitation, allowing for interesting applications in many areas, including quantum optics and plasma physics. Higher resonance mode center frequencies were found to deviate from expected frequencies when compared to membrane theory due to the large aspect ratio and high Young´s modulus-to-stress ratio.
  • Keywords
    Young´s modulus; diamond; diaphragms; elemental semiconductors; frequency measurement; microfabrication; micromechanical resonators; microsensors; silicon; thin film sensors; C; Si; Young modulus-to-stress ratio; excitation frequency measurement; low drive voltage; low nonlinear response; membrane theory; nonlinear Duffing regime; parametric excitation; plasma physics; polycrystalline diamond circular resonant diaphragm; quality factor; quantum optics; resonant MEMS structure; resonant sensor; structural material; thin film sensor; ultrathin large area circular polycrystalline diamond diaphragm; Diamonds; Films; Frequency measurement; Measurement by laser beam; Resonant frequency; Sensors; Young´s modulus;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2013 IEEE
  • Conference_Location
    Baltimore, MD
  • ISSN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2013.6688504
  • Filename
    6688504