DocumentCode :
657448
Title :
Design of stacked wafers AMC at 920 MHz for metallic object detection in RFID application
Author :
Abu, M. ; Hussin, E.E. ; Othman, A.R. ; Yatim, N.M. ; Johar, Fauzi Mohd ; Munawar, R.F.
Author_Institution :
Univ. Teknikal Malaysia Melaka, Durian Tunggal, Malaysia
fYear :
2013
fDate :
22-25 Sept. 2013
Firstpage :
236
Lastpage :
239
Abstract :
Artificial Magnetic Conductor, AMC is introduced into RFID application to overcome the problem of metal object detection. The AMC act as the Perfect Magnetic Conductor, PMC exhibits a reflectivity of +1 (in-phase reflection). In this paper, the stacked wafers AMC structure is designed to operate at 920 MHz frequency. The proposed stacked wafers AMC is an evolution from the basic square patch AMC. By introducing different size of slots into the square patch will help to reduce the frequency hence increase the bandwidth of the reflection phase. Another method to increase the bandwidth is by increasing the thickness of the structure. For the single cell of stacked wafers AMC proposed in this paper, the simulated bandwidth is 3.5% with reduced size of 45.56% than the square AMC. An optimized structure of 3×2 stacked wafers AMC give better return loss = -21.8 dB and gain = 3.04 dB with total efficiency of 82.3%.
Keywords :
conductors (electric); object detection; radiofrequency identification; PMC; RFID application; artificial magnetic conductor; frequency 920 MHz; metallic object detection; perfect magnetic conductor; stacked wafers AMC; Antenna radiation patterns; Bandwidth; Dipole antennas; Gain; Metals; Radiofrequency identification; Reflection; artificial magnetic conductor; bandwidth; dipole antenna; frequency respond; high impedance surface; reflection phase; stacked wafers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wireless Technology and Applications (ISWTA), 2013 IEEE Symposium on
Conference_Location :
Kuching
ISSN :
2324-7843
Print_ISBN :
978-1-4799-0155-5
Type :
conf
DOI :
10.1109/ISWTA.2013.6688778
Filename :
6688778
Link To Document :
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