DocumentCode :
658266
Title :
Research on performance evaluation criterion of integrated earthing system for high-speed railway
Author :
Zhang Shouli
Author_Institution :
China Railway First Survey & Design Inst. Group Co., Ltd., Xian, China
fYear :
2013
fDate :
29-31 Oct. 2013
Firstpage :
654
Lastpage :
658
Abstract :
This Paper researches the existing evaluation criterion of integrated earthing system for high-speed railway and analyzes the new problems encountered in China´s rapid development according to the fact that the integrated earthing engineering has only just begun in China, which is related to the construction of high-speed railway. For these problems, presently there isn´t any experience abroad, which can be used for reference. On this basis, in addition to theoretically analyzing the problems existing when the “evaluation criterion no more than 1Ω” is still used in the areas with larger earth resistivity in line with the overseas evaluation criterion on that the earthing resistance of integrated earthing system should not be greater than 1Ω and according to the characteristics of vast region and large distribution range of earth resistivity, this paper comes up with the new evaluation criterion on the field resistance of integrated earthing system through field test and verification and on the premise of ensuring that the integrated earthing system functions protectively, as well as the countermeasures against the problems of the integrated earthing system project of this stage in the areas with high earth resistivity.
Keywords :
earthing; electric locomotives; railways; earth resistivity distribution range; high-speed railway; integrated earthing system; performance evaluation criterion; Conductivity; Discharges (electric); Electrodes; Grounding; Rail transportation; Resistance; Soil; countermeasure; evaluation criterion; integrated earthing; research;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), 2013 IEEE 5th International Symposium on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4673-6077-7
Type :
conf
DOI :
10.1109/MAPE.2013.6689926
Filename :
6689926
Link To Document :
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