Title :
Table of contents
Abstract :
The following topics are dealt with: 3D IC design for test; power aware testing; at-speed testing; analog-mixed signal test; memory defects; converter testing; 3D IC interposer test; defect-based test; memory testing; automatic test pattern generation; process variations; and yield enhancement and security.
Keywords :
automatic test pattern generation; design for testability; integrated circuit testing; integrated circuit yield; integrated memory circuits; mixed analogue-digital integrated circuits; three-dimensional integrated circuits; 3D IC interposer test; 3D integrated circuits; analog-mixed signal test; at-speed testing; automatic test pattern generation; converter testing; defect-based test; design for test; memory defects; memory testing; power aware testing; process variations; security; yield enhancement;
Conference_Titel :
Test Symposium (ATS), 2013 22nd Asian
Conference_Location :
Jiaosi Township
