• DocumentCode
    658544
  • Title

    Cost-Effective TAP-Controlled Serialized Compressed Scan Architecture for 3D Stacked ICs

  • Author

    Chen-An Chen ; Yee-Wen Chen ; Chun-Lung Hsu ; Ming-Hsueh Wu ; Kun-Lun Luo ; Bing-Chuan Bai ; Liang-Chia Cheng

  • Author_Institution
    Inf. & Commun. Res. Labs, Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    18-21 Nov. 2013
  • Firstpage
    107
  • Lastpage
    108
  • Abstract
    This paper proposes a cost-effective TAP-controlled serialized compressed scan architecture (SCSA) design to support known-good-die (KGD) test, known-good-stack (KGS) test and post-bond test in the 3D stacked ICs (3D-SICs) configuration. Additionally, a serialized compressed signal generator (SCSG) design is also developed of the proposed scheme to generate the corresponding controlled signals for SCSA to ensure the test cost reduction. Experimental results and comparisons show that the proposed scheme can effectively achieve the good performance in test pin count and test time reduction with little extra hardware overhead penalty.
  • Keywords
    costing; design for testability; integrated circuit testing; three-dimensional integrated circuits; 3D stacked IC; SCSA; TAP-controlled serialized compressed scan architecture; cost-effective; known-good-die test; post-bond test; test cost reduction; test pin count; test time reduction; Discrete Fourier transforms; Multimedia communication; Pins; Ports (Computers); Stacking; Testing; Three-dimensional displays; 3D-SIC; SCSA; SCSG;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium (ATS), 2013 22nd Asian
  • Conference_Location
    Jiaosi Township
  • ISSN
    1081-7735
  • Type

    conf

  • DOI
    10.1109/ATS.2013.29
  • Filename
    6690625