Title :
A pressure/oxygen/temperature sensing SoC for multimodality intracranial neuromonitoring
Author :
Wai Pan Chan ; George, Aby K. ; Narducci, Margarita Sofia ; Daw Don Cheam ; Siew Chong Leong ; Ming-Lin Tsai ; Rahman, Abdur R. A. ; Mi Kyoung Park ; Zhi Hui Kong ; Rao, Jai Prashanth ; Yuan Gao ; Minkyu Je
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
A fully integrated SoC for multimodality intracranial neuromonitoring is presented. This SoC includes a capacitive MEMS pressure sensor, an electrochemical oxygen sensor, a solid-state temperature sensor and sensor interface circuits in a single chip. Chopper stabilization and dynamic element matching techniques are applied in sensor interface circuits to reduce circuit noise and offset. On-chip calibration is implemented for each sensor to compensate process variations. Measured accuracies of the pressure, oxygen, and temperature sensors are ±1 mmHg, ±1 mmHg, and ±0.2 oC, respectively. Implemented in 0.18-μm CMOS, the SoC occupies an area of 1.4 mm × 4mm and consumes 188-μW DC power.
Keywords :
CMOS integrated circuits; biomedical electronics; chemical sensors; circuit noise; microsensors; neurophysiology; pressure sensors; system-on-chip; temperature sensors; CMOS; capacitive MEMS pressure sensor; chopper stabilization; circuit noise reduction; dynamic element matching; electrochemical oxygen sensor; integrated SoC; multimodality intracranial neuromonitoring; offset reduction; on-chip calibration; oxygen sensing SoC; power 188 muW; pressure sensing SoC; process variation compensation; sensor interface circuits; size 0.18 mum; size 1.4 mm; size 4 mm; solid-state temperature sensor; temperature sensing SoC; CMOS integrated circuits; Capacitance; Micromechanical devices; Pressure measurement; System-on-chip; Temperature measurement; Temperature sensors;
Conference_Titel :
Solid-State Circuits Conference (A-SSCC), 2013 IEEE Asian
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-0277-4
DOI :
10.1109/ASSCC.2013.6690989
