• DocumentCode
    659003
  • Title

    Considering fabrication in sustainable computing

  • Author

    Jones, Alex K. ; Chen, Yuanfeng ; Collinge, William O. ; Xu, Hao ; Schaefer, Laura A. ; Landis, Amy E. ; Bilec, Melissa M.

  • Author_Institution
    Electr. & Comput. Eng., Univ. of Pittsburgh, Pittsburgh, PA, USA
  • fYear
    2013
  • fDate
    18-21 Nov. 2013
  • Firstpage
    206
  • Lastpage
    210
  • Abstract
    The term green computing has become effectively synonymous with low-power/energy computing. However, for computing to be truly sustainable, all phases of the system life-cycle must be considered. In contrast to the considerable effort that has been applied to address the use-phase energy consumption issue - ranging from battery powered embedded systems to data center servers - there is limited awareness or attention to the considerable energy consumption and environmental impacts from semiconductor fabrication. Current research indicates that fabrication is responsible for a significant factor of the energy utilized by these systems throughout their life-cycle. The trends of technology scaling coupled with developing hybrid fabrication solutions for integration of emerging technologies, while beneficial for use-phase power consumption, exacerbate these increasing environmental impacts from fabrication. Thus, design for sustainability is a grand challenge that must be addressed over the next decade.
  • Keywords
    computer centres; embedded systems; energy consumption; green computing; battery powered embedded systems; data center servers; developing hybrid fabrication solutions; energy consumption; environmental impacts; green computing; low-power-energy computing; semiconductor fabrication; sustainable computing; system lifecycle; technology scaling; use-phase energy consumption issue; use-phase power consumption; Buildings; Computers; Fabrication; Integrated circuits; Market research; Monitoring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2013 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2013.6691120
  • Filename
    6691120