DocumentCode :
659020
Title :
Improving platform energy-chip area trade-off in near-threshold computing environment
Author :
Hao Wang ; Sinkar, Abhishek A. ; Nam Sung Kim
Author_Institution :
Univ. of Wisconsin-Madison, Madison, WI, USA
fYear :
2013
fDate :
18-21 Nov. 2013
Firstpage :
318
Lastpage :
325
Abstract :
Recent studies on near-threshold computing (NTC) investigated an optimum supply voltage which yields minimum energy per operation (Emin), and proposed various optimization techniques at the device, circuit, and architecture levels to further minimize Emn. However, most of these studies often overlooked the significance of (i) energy consumption of off-chip memory accesses; (ii) energy loss of voltage regulators (VRs); and (iii) the cost of chip area in NTC environment. In this paper, we first demonstrate the increasing significance of (i) and (ii) in NTC environment with a comprehensive set of device, circuit, and architectural-level models. Second, we explore technology optimization to improve the trade-off between platform energy and chip area considering (iii) in NTC environment. The experimental results show that our optimized technology achieves 4% to 21% energy reduction for various chip area constraints, achieving significant improvement in trade-off between platform energy and chip area for a wide range of parallel benchmarks.
Keywords :
energy consumption; parallel processing; power aware computing; voltage regulators; NTC environment; architectural-level models; architecture level optimization techniques; circuit level optimization techniques; circuit-level models; device level optimization techniques; device-level models; energy reduction; minimum energy per operation; near-threshold computing environment; off-chip memory access energy consumption; optimum supply voltage; parallel benchmarks; platform energy-chip area trade-off; voltage regulator energy loss; Analytical models; Benchmark testing; Energy consumption; Energy efficiency; Memory management; Optimization; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design (ICCAD), 2013 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
ISSN :
1092-3152
Type :
conf
DOI :
10.1109/ICCAD.2013.6691138
Filename :
6691138
Link To Document :
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