DocumentCode
661527
Title
Novel 3.3-kV advanced trench HiGT with low loss and low dv/dt noise
Author
Toyota, Yoshiaki ; Watanabe, So ; Arai, Taiga ; Wakagi, Masatoshi ; Mori, Mutsuhiro ; Shinagawa, Masashi ; Azuma, Katsunori ; Shima, Yuji ; Oda, Tetsuo ; Toyoda, Yasushi ; Saito, Katsuaki
Author_Institution
Hitachi Res. Lab., Hitachi Ltd., Hitachi, Japan
fYear
2013
fDate
26-30 May 2013
Firstpage
29
Lastpage
32
Abstract
Novel 3.3-kV trench IGBT with low loss and low dvAK/dt noise was developed. The structural feature of the IGBTs is deep p-WELL layers separated from trench gates. This structure suppresses excess VGE overshoot and then reduces recovery dvAK/dt. Moreover, this effect is enhanced by reducing the resistance of the deep p-WELL layers (RFP). It was found that, for the first time, the trade-off characteristics between VCEsat and recovery dvAK/dt were drastically improved by separating p-WELL layers from trench gates and decreasing RFP. The recovery dvAK/dt could be reduced by 79% more than that for the conventional trench IGBT, maintaining a small VCEsat and Eon equal to the conventional one.
Keywords
insulated gate bipolar transistors; IGBT; advanced trench HiGT; deep p-WELL layers; low dv-dt noise; trade-off characteristics; trench gates; voltage 3.3 kV; Charge carrier processes; Electrodes; Electromagnetic interference; Insulated gate bipolar transistors; Logic gates; Noise; Resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
Conference_Location
Kanazawa
ISSN
1943-653X
Print_ISBN
978-1-4673-5134-8
Type
conf
DOI
10.1109/ISPSD.2013.6694391
Filename
6694391
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