• DocumentCode
    661527
  • Title

    Novel 3.3-kV advanced trench HiGT with low loss and low dv/dt noise

  • Author

    Toyota, Yoshiaki ; Watanabe, So ; Arai, Taiga ; Wakagi, Masatoshi ; Mori, Mutsuhiro ; Shinagawa, Masashi ; Azuma, Katsunori ; Shima, Yuji ; Oda, Tetsuo ; Toyoda, Yasushi ; Saito, Katsuaki

  • Author_Institution
    Hitachi Res. Lab., Hitachi Ltd., Hitachi, Japan
  • fYear
    2013
  • fDate
    26-30 May 2013
  • Firstpage
    29
  • Lastpage
    32
  • Abstract
    Novel 3.3-kV trench IGBT with low loss and low dvAK/dt noise was developed. The structural feature of the IGBTs is deep p-WELL layers separated from trench gates. This structure suppresses excess VGE overshoot and then reduces recovery dvAK/dt. Moreover, this effect is enhanced by reducing the resistance of the deep p-WELL layers (RFP). It was found that, for the first time, the trade-off characteristics between VCEsat and recovery dvAK/dt were drastically improved by separating p-WELL layers from trench gates and decreasing RFP. The recovery dvAK/dt could be reduced by 79% more than that for the conventional trench IGBT, maintaining a small VCEsat and Eon equal to the conventional one.
  • Keywords
    insulated gate bipolar transistors; IGBT; advanced trench HiGT; deep p-WELL layers; low dv-dt noise; trade-off characteristics; trench gates; voltage 3.3 kV; Charge carrier processes; Electrodes; Electromagnetic interference; Insulated gate bipolar transistors; Logic gates; Noise; Resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
  • Conference_Location
    Kanazawa
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4673-5134-8
  • Type

    conf

  • DOI
    10.1109/ISPSD.2013.6694391
  • Filename
    6694391