Direct liquid cooling module with high reliability solder joining technology for automotive applications

Author

Morozumi, Akira ; Hokazono, Hiroaki ; Nishimura, Yoshitaka ; Ikeda, Yoshinari ; Nabetani, Yoichi ; Takahashi, Yoshikazu

Author_Institution

Next Generation Module Dev. Center, Fuji Electr. Co., Ltd., Matsumoto, Japan

fYear

2013

fDate

26-30 May 2013

Firstpage

109

Lastpage

112

Abstract

We developed the direct-liquid-cooling IGBT module which enabled downsizing of a power control unit for HEV system and high reliability simultaneously. This module eliminates thermal grease by unifying a ceramic substrate and a heat sink. It contributes this module realized the reduction of thermal resistance 30 % compared to the conventional indirect liquid cooling type. High thermal conductive Si₃N₄ ceramics for the substrate and lightweight aluminum heat sink that are suitable for automotive use demand are applied. The technological challenge of this module is to overcome the decrease of the reliability of the joint by large CTE mismatch between substrate and heat sink. We developed the Sn-Sb based solder material which can attain high reliability for automotive use with large CTE mismatch components. And IGBT module with this new solder is applied to HEV.

Keywords

aluminium alloys; antimony alloys; automotive electronics; ceramics; cooling; heat sinks; hybrid electric vehicles; insulated gate bipolar transistors; modules; semiconductor device reliability; solders; thermal conductivity; thermal resistance; tin alloys; Al; HEV system; Si₃N₄; Sn-Sb; aluminum heat sink; automotive applications; ceramic substrate; direct-liquid-cooling IGBT module; high reliability solder joining technology; high thermal conductive ceramics; hybrid electric vehicle; indirect liquid cooling type; large CTE mismatch; solder material; thermal grease elimination; thermal resistance reduction; Ceramics; Heat sinks; Materials reliability; Resistance heating; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on

Conference_Location

Kanazawa

ISSN

1943-653X

Print_ISBN

978-1-4673-5134-8

Type

conf

DOI

10.1109/ISPSD.2013.6694408

Filename

6694408