DocumentCode :
661601
Title :
Full-Integrated power module for motor drive applications
Author :
Qing Hua ; Zehong Li ; Bo Zhang ; Weizhong Chen ; Xiangjun Huang ; Dekai Cheng
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear :
2013
fDate :
26-30 May 2013
Firstpage :
289
Lastpage :
292
Abstract :
This paper proposes an IGBT-based full-integrated power module (FIPM) that we have newly developed for compactness, high performance and low cost motor drive applications. It integrates all necessary power and control components to form a motor control system for the inverter air conditioner. Inside the FIPM there are a copper-dielectric-aluminum (CDA) substrate and a printed circuit board (PCB) substrate. All the power components such as the IGBTs and the freewheeling diodes (FWDs) are soldered directly on the CDA substrate, while the low power components such as the gate drivers, the micro control unit (MCU) and the passive components are assembled on the PCB substrate, which offers significant flexibility in the circuit layout. With this type of structure, the switching noise of the power devices that coupling to the gate drivers are effectively prevented. The electrical performance is improved by utilizing trench gate non-punch through (NPT) IGBTs which matched with its anti-parallel FWDs. Additionally, the reliability of the FIPM is further enhanced by using the aluminum layer double-sided oxidizing technology of the CDA substrate. Moreover, a large reduction of the junction to case thermal resistance of this FIPM is achieved by utilizing the half-molded resin package technology, which is especially suitable for the high power applications that need extremely good heat conductivity.
Keywords :
air conditioning; dielectric materials; driver circuits; insulated gate bipolar transistors; invertors; machine control; microassembling; microcontrollers; modules; motor drives; oxidation; passive networks; printed circuit layout; printed circuit motors; resins; semiconductor device packaging; semiconductor device reliability; semiconductor diodes; soldering; thermal resistance; CDA substrate; FIPM; FWD; IGBT; MCU; NPT; PCB substrate; aluminum layer double-sided oxidizing technology; assembling; circuit layout; copper-dielectric-aluminum substrate; freewheeling diode; full-integrated power module; gate driver coupling; half-molded resin package technology; heat conductivity; inverter air conditioner; microcontrol unit; motor control system; motor drive application; passive component; printed circuit board substrate; reliability; soldering; switching noise; thermal resistance junction; trench gate nonpunch through; Insulated gate bipolar transistors; Inverters; Logic gates; Motor drives; Multichip modules; Substrates; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
Conference_Location :
Kanazawa
ISSN :
1943-653X
Print_ISBN :
978-1-4673-5134-8
Type :
conf
DOI :
10.1109/ISPSD.2013.6694466
Filename :
6694466
Link To Document :
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