• DocumentCode
    661609
  • Title

    15 kV SiC PiN diodes achieve 95% of avalanche limit and stable long-term operation

  • Author

    Sundaresan, Siddarth ; Marripelly, Madhuri ; Arshavsky, Svetlana ; Singh, Ranbir

  • Author_Institution
    GeneSiC Semicond. Inc., Dulles, VA, USA
  • fYear
    2013
  • fDate
    26-30 May 2013
  • Firstpage
    175
  • Lastpage
    177
  • Abstract
    This paper reports on ultra-high voltage, >15 kV SiC PiN rectifiers exhibiting >95% of the avalanche rating and 115 V/μm. This is one of a few reports on > 15 kV blocking voltages measured on any single semiconductor device, and the highest percentage of the avalanche limit ever reported on devices fabricated on > 100 μm thick SiC epilayers. Excellent stability of on-state voltage drop (VF) is displayed by 5.76 mm2 and large-area, 41 mm2 PiN rectifiers, when continually biased at high current densities for several days. The impact of carrier lifetime on the device performance for SiC bipolar devices with ultra-thick (≥100 μm) base layers is investigated by comparing I-V-T characteristics of SiC PiN rectifiers fabricated on 100 μm and 130 μm thick epilayers.
  • Keywords
    carrier lifetime; current density; p-i-n diodes; power semiconductor diodes; semiconductor device breakdown; semiconductor epitaxial layers; silicon compounds; solid-state rectifiers; wide band gap semiconductors; I-V-T characteristics; SiC; SiC PiN diodes; SiC PiN rectifiers; SiC bipolar devices; avalanche limit; blocking voltages; carrier lifetime impact; current densities; on-state voltage drop; size 100 mum to 130 mum; stability; stable long-term operation; thick SiC epilayers; voltage 15 kV; Charge carrier lifetime; Current measurement; Rectifiers; Silicon carbide; Temperature measurement; Thickness measurement; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
  • Conference_Location
    Kanazawa
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4673-5134-8
  • Type

    conf

  • DOI
    10.1109/ISPSD.2013.6694474
  • Filename
    6694474