Title :
Robustness of GaN vertical superjunction HEMT
Author :
Zhongda Li ; Chow, T. Paul
Author_Institution :
Center for Integrated Electron., Rensselaer Polytech. Inst. Troy, Troy, NY, USA
Abstract :
We have examined the robustness of the novel enhancement-mode GaN vertical superjunction HEMT using numerical simulations, which has been designed previously and projected to have best Ron, sp of 4.2 mQ-cm2 and BV of 12.4kV, and compared it with a GaN vertical HEMT with conventional drift region. The GaN vertical superjunction HEMT with 8 μm pillar width shows 7X higher on-state current level and 1/5 of the Ron, sp compared with The simulated on-state breakdown voltage of the GaN vertical superjunction HEMT structure shows 4.5% drop from the off-state breakdown voltage, and is only slightly higher than the 1.7% drop of the conventional GaN vertical HEMT.
Keywords :
III-V semiconductors; electric breakdown; high electron mobility transistors; junction gate field effect transistors; numerical analysis; wide band gap semiconductors; GaN; enhancement-mode vertical superjunction HEMT; numerical simulation; off-state breakdown voltage; on-state current level; robustness; simulated on-state breakdown voltage; size 8 mum; voltage 12.4 kV; Electric breakdown; Electric fields; Gallium nitride; HEMTs; Logic gates; Robustness;
Conference_Titel :
Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
Conference_Location :
Kanazawa
Print_ISBN :
978-1-4673-5134-8
DOI :
10.1109/ISPSD.2013.6694484