DocumentCode
662050
Title
A 28 dBm Pout 5-GHz CMOS power amplifier using integrated passive device power combining transformer
Author
Kuei-Cheng Lin ; Hwann-Kaeo Chiou ; Po-Chang Wu ; Chun-Lin Ko ; Hann-Huei Tsai ; Ying-Zong Juang
Author_Institution
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
fYear
2013
fDate
5-8 Nov. 2013
Firstpage
766
Lastpage
768
Abstract
This work presents a 5-GHz power amplifier (PA) based on a tsmc 0.18-μm CMOS process. A high quality factor (Q) transformer for use by the PA was fabricated using wafer-level integrated passive device (IPD) technology and stacked on top of the active region of the CMOS PA chip. PAs with and without the IPD transformer were designed and their performance was compared. For a 1.8-V supply voltage, the IPD CMOS-PA achieved an output power of 28 dBm and power added efficiency (PAE) of 25%; these were, respectively, 1.3 dBm and 6% higher than the corresponding output parameters of the typical CMOS PA at the same power consumption. In sending OFDM/64-QAM modulated signals, the IPD CMOS-PA produced a measured adjacent channel power radio (ACPR) and error vector magnitude (EVM) of -43 dBc and 1.6%, respectively.
Keywords
CMOS integrated circuits; Q-factor; microwave integrated circuits; microwave power amplifiers; power combiners; power transformers; CMOS PA chip; IPD CMOS-PA; OFDM/64-QAM modulated signals; adjacent channel power radio; error vector magnitude; frequency 5 GHz; integrated passive device power combining transformer; power added efficiency; power amplifier; quality factor transformer; size 0.18 mum; voltage 1.8 V; wafer-level integrated passive device technology; CMOS integrated circuits; CMOS process; Circuit faults; Impedance; Power amplifiers; Power generation; Substrates; Adjacent channel power ratio (ACPR); CMOS; Integrated passive device (IPD); Power amplifier (PA); error vector magnitude (EVM);
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference Proceedings (APMC), 2013 Asia-Pacific
Conference_Location
Seoul
Type
conf
DOI
10.1109/APMC.2013.6694924
Filename
6694924
Link To Document