Vertical signal transmission by non-contact technology application for 3DIC

Author

Jun-Kai Wang ; Ren-Fang Hsu ; Wen-Te Chien ; Sung-Mao Wu ; Cheng-Chang Chen ; Ming-Shan Lin

Author_Institution

Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan

fYear

2013

fDate

5-8 Nov. 2013

Firstpage

827

Lastpage

829

Abstract

In order to solve the problem of process and cost in 3D-IC, novel non-contact signal transmission with coupling loops have been presented. In this study, we design the broadband, well reproducibility, well directivity and low loss coupling loops to transmit signal between different chips or ICs in 3DIC application, and establishing physical model up to 10GHz with coupling effect and loop effect to restore the signal radiation. By this method, the overall signal transmission of TSV can be the same as the non-contact technology. People can use this design to replace the TSV technology in the future.

Keywords

integrated circuit design; integrated circuit modelling; integrated circuit packaging; three-dimensional integrated circuits; 3DIC; TSV technology; low loss coupling loop; noncontact signal transmission; noncontact technology; signal radiation; three-dimensional integrated circuits; through-silicon-via technology; vertical signal transmission; Broadband communication; Capacitance; Coplanar waveguides; Couplings; Loss measurement; Microwave theory and techniques; Through-silicon vias; 3DIC; Non-contact; Radiation model; Signal transmission; TSV;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings (APMC), 2013 Asia-Pacific

Conference_Location

Seoul

Type

conf

DOI

10.1109/APMC.2013.6694946

Filename

6694946