Multilayer compact hybrid coupler based on vertical microstrip transition

Author

Young Kim ; Seok-Hyun Sim ; Young-Chul Yoon

Author_Institution

Sch. of Electron. Eng., Kumoh Nat. Inst. of Technol., Gumi, South Korea

fYear

2013

fDate

5-8 Nov. 2013

Firstpage

914

Lastpage

916

Abstract

This paper proposes a multilayer compact hybrid coupler based on vertical microstrip transition. This transition is a sandwich structure with via hole to connect two microstrip lines in different layer. For designing a compact microwave passive circuit, the microstrip line using via-hole transition is proposed to reduce a size of microwave circuit with long transmission line. For the validation of the microstrip line with via-hole transition, the multilayer hybrid coupler is implemented at center frequency of 2 GHz. The measured performances are in good agreement with simulation results and about 50% size reduction compare to conventional coupler.

Keywords

UHF circuits; microstrip circuits; microstrip couplers; microstrip transitions; microwave circuits; passive networks; sandwich structures; compact microwave passive circuit; frequency 2 GHz; microstrip line; microwave circuit; multilayer compact hybrid coupler; sandwich structure; size reduction; transmission line; vertical microstrip transition; via-hole transition; Couplers; Microstrip; Microwave circuits; Nonhomogeneous media; Sandwich structures; Transmission line measurements; Microstrip transition; multilayer circuit; passive circuit; size reduction;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings (APMC), 2013 Asia-Pacific

Conference_Location

Seoul

Type

conf

DOI

10.1109/APMC.2013.6694972

Filename

6694972