• DocumentCode
    662667
  • Title

    Silicon carbide integrated circuits for extreme environments

  • Author

    Kashyap, Avinash S. ; Cheng-Po Chen ; Ghandi, Reza ; Patil, Abhijit ; Andarawis, Emad ; Liang Yin ; Shaddock, David ; Sandvik, Peter ; Kun Fang ; Zhenzhen Shen ; Johnson, Wayne

  • Author_Institution
    Gen. Electr. Global Res. Center, Niskayuna, NY, USA
  • fYear
    2013
  • fDate
    27-29 Oct. 2013
  • Firstpage
    60
  • Lastpage
    63
  • Abstract
    Analog and digital integrated circuits capable of operating reliably at 300 °C for 2000 hours were designed and fabricated in silicon carbide. These circuits are critical for the development of tools and instrumentation for geothermal exploration. Lateral MOSFETs and resistors were built on Si-face, 4°-off, N+ 4H-SiC substrates. Compact models of these devices were then generated and used to design the circuits, including operational amplifiers, ring oscillators, counters, shift registers and logic gates. The circuits were then fabricated and packaged using specially developed high temperature packaging processes. The integrated circuits were designed to interface with sensors and transducers to produce analog signals that can be digitized and transmitted via a telemetry system capable of sustained operation at 300 °C.
  • Keywords
    MOSFET; analogue integrated circuits; counting circuits; digital integrated circuits; logic gates; operational amplifiers; oscillators; resistors; semiconductor device models; sensors; shift registers; silicon compounds; telemetry; transducers; wide band gap semiconductors; 4°-off 4H-SiC substrates; MOSFET; N+ 4H-SiC substrates; Si-face 4H-SiC substrates; SiC; analog integrated circuits; analog signals; compact models; counters; digital integrated circuits; extreme environments; high temperature packaging processes; logic gates; operational amplifiers; resistors; ring oscillators; sensors; shift registers; silicon carbide integrated circuits; telemetry system; temperature 300 degC; time 2000 hour; transducers; Generators; Integrated circuit modeling; Radiation detectors; Semiconductor process modeling; Silicon carbide; Temperature sensors; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2013 IEEE Workshop on
  • Conference_Location
    Columbus, OH
  • Type

    conf

  • DOI
    10.1109/WiPDA.2013.6695562
  • Filename
    6695562