• DocumentCode
    662672
  • Title

    Characterization and performance comparison of reverse blocking SiC and Si based switch

  • Author

    De, Avik ; Roy, Sandip ; Bhattacharya, Surya ; Divan, Deepak M.

  • Author_Institution
    Dept. of Electr. Eng., North Carolina State Univ., Raleigh, NC, USA
  • fYear
    2013
  • fDate
    27-29 Oct. 2013
  • Firstpage
    80
  • Lastpage
    83
  • Abstract
    In this paper a custom made Reverse Voltage Blocking 1200V SiC switch or “current switch” (1200V SiC MOSFET in series with a 1200V SiC JBS diode) is compared with various other combinations of Reverse Voltage Blocking switches (with 1200V Si-IGBT, SiC MOSFET and Si-PIN diodes and SiC JBS diodes). The devices are tested under Reverse Voltage Commutation, Switch Overlap (turn on at non-zero current but zero voltage) and Hard Switching conditions. Test circuits have been constructed and tested at different dc voltage levels with various combinations of devices. The custom made current switch results show remarkable reduction of loss owing to reduced leakage inductance of the package. A new form of switching characteristic has been noticed and presented in this paper. The main motivation of the paper is to make a fair judgment on device selection for current stiff based hard and soft switching topologies.
  • Keywords
    MOSFET; elemental semiconductors; field effect transistor switches; insulated gate bipolar transistors; integrated circuit testing; network topology; p-i-n diodes; silicon; silicon compounds; wide band gap semiconductors; Si; Si-IGBT; Si-PIN diodes; SiC; SiC JBS diode; SiC MOSFET; SiC switch; current switch; hard switching topologies; leakage inductance; reverse voltage blocking switches; soft switching topologies; switch overlap; test circuits; voltage 1200 V; Insulated gate bipolar transistors; MOSFET; Silicon; Silicon carbide; Soft switching; Switches; Switching circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2013 IEEE Workshop on
  • Conference_Location
    Columbus, OH
  • Type

    conf

  • DOI
    10.1109/WiPDA.2013.6695567
  • Filename
    6695567