• DocumentCode
    662683
  • Title

    Fabrication and evaluation of a high performance SiC inverter for wireless power transfer applications

  • Author

    Onar, Omer C. ; Campbell, Stuart ; Ning, Peng ; Miller, John M. ; Zhenxian Liang

  • Author_Institution
    Power Electron. & Electr. Machinery Group, Oak Ridge Nat. Lab., Oak Ridge, TN, USA
  • fYear
    2013
  • fDate
    27-29 Oct. 2013
  • Firstpage
    125
  • Lastpage
    130
  • Abstract
    In this study, a high power density SiC high efficiency wireless power transfer converter system via inductive coupling has been designed and developed. The detailed power module design, cooling system design and power stage development are presented. The successful operation of rated power converter system demonstrates the feasible wireless charging plan. One of the most important part of this study is the wind bandgap devices packaged at the Oak Ridge National Laboratory (ORNL) using the in-house packaging technologies by employing the bare SiC dies acquired from CREE, which are rated at 50 A/1200 V each. These packaged devices are also in-house tested and characterized using ORNL´s Device Characterization Facility. The successful operation of the proposed inverter is experimentally verified and the efficiency and operational characteristics of the inverter are also revealed.
  • Keywords
    invertors; power semiconductor devices; semiconductor device packaging; silicon compounds; wide band gap semiconductors; CREE; ORNL Device Characterization Facility; SiC; cooling system design; current 50 A; high performance SiC inverter; in-house packaging technologies; inductive coupling; power converter; power module design; power stage development; voltage 1200 V; wind bandgap devices; wireless power transfer applications; Capacitors; Coils; Inverters; Multichip modules; Rectifiers; Silicon carbide; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2013 IEEE Workshop on
  • Conference_Location
    Columbus, OH
  • Type

    conf

  • DOI
    10.1109/WiPDA.2013.6695578
  • Filename
    6695578