• DocumentCode
    662686
  • Title

    Modelling of temperature dependence on current collapse phenomenon in AlGaN/GaN HEMT devices

  • Author

    Samudra, Ganesh S. ; Liang, Yung C. ; Yuling Li ; Yee-Chia Yeo

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2013
  • fDate
    27-29 Oct. 2013
  • Firstpage
    139
  • Lastpage
    142
  • Abstract
    This paper reports the studies of the temperature dependence on the current collapse behaviours of AlGaN/GaN high electron mobility transistors (HEMTs). A physical-based model is proposed to analyse the trapping and de-trapping process along the surface with the effect of temperature included for the first time. The temperature-dependent gate leakage current is treated as the source for electron trapping and it can be predicted by the proposed model quantitatively. Then the relationship of the capture cross section of the surface trap on the electric field is investigated with respect to temperature variations. By applying the Poole-Frenkel emission mechanism, the dynamics of the trapped electrons at different temperatures are described in this model. The analytical results on current recovery time-constant are then verified by comparing with the laboratory measurement as well as the numerical results obtained from Sentaurus TCAD simulations.
  • Keywords
    III-V semiconductors; Poole-Frenkel effect; aluminium compounds; electron traps; gallium compounds; high electron mobility transistors; leakage currents; semiconductor device models; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT devices; Poole-Frenkel emission mechanism; Sentaurus TCAD simulations; capture cross section; current collapse phenomenon; de-trapping process; electric field; electron trapping; gate leakage current; high electron mobility transistors; physical-based model; surface trap; temperature dependence modelling; trapping process; Aluminum gallium nitride; Analytical models; Current measurement; Gallium nitride; HEMTs; Logic gates; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2013 IEEE Workshop on
  • Conference_Location
    Columbus, OH
  • Type

    conf

  • DOI
    10.1109/WiPDA.2013.6695581
  • Filename
    6695581