• DocumentCode
    66301
  • Title

    Temporal Stability of Y–Ba–Cu–O Nano Josephson Junctions from Ion Irradiation

  • Author

    Cybart, Shane A. ; Roediger, P. ; Ke Chen ; Parker, J.M. ; Cho, Ethan Y. ; Wong, T.J. ; Dynes, Robert C.

  • Author_Institution
    Mater. Sci. Div., Lawrence Berkeley Nat. Lab., Berkeley, CA, USA
  • Volume
    23
  • Issue
    3
  • fYear
    2013
  • fDate
    Jun-13
  • Firstpage
    1100103
  • Lastpage
    1100103
  • Abstract
    We investigate the temporal stability of YBa2Cu3 O7-δ Josephson junctions created by ion irradiation through a nanoscale implant mask fabricated using electron beam lithography and reactive ion etching. A comparison of current-voltage characteristics measured for junctions after fabrication and eight years of storage at room temperature show a slight decrease in critical current and increase in normal state resistance consistent with broadening of the weak link from diffusion of defects. Shapiro step measurements performed eight years after fabrication reveal that device uniformity is maintained and is strong evidence that these devices have excellent temporal stability for applications.
  • Keywords
    Josephson effect; barium compounds; electrical resistivity; electron beam lithography; high-temperature superconductors; ion beam effects; masks; sputter etching; yttrium compounds; Shapiro step measurements; Y-Ba-Cu-O nanoJosephson junctions; YBa2Cu3O7-δ; critical current; current-voltage characteristics; defect diffusion; device uniformity; electron beam lithography; ion irradiation; nanoscale implant mask; normal state resistance; reactive ion etching; temporal stability; weak link broadening; Current measurement; Electrical resistance measurement; Fabrication; Josephson junctions; Junctions; Temperature measurement; Yttrium barium copper oxide; Ion implantation; Josephson junctions; nanolithography; yttrium barium copper oxide;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2012.2227646
  • Filename
    6353171