DocumentCode
663237
Title
Computational study on thermal effects of coil-based implantable magnetic stimulation using finite element analysis
Author
Heejin Park ; Sohee Kim
Author_Institution
Sch. of Mechatron., Gwangju Inst. of Sci. & Technol., Gwangju, South Korea
fYear
2013
fDate
6-8 Nov. 2013
Firstpage
1497
Lastpage
1500
Abstract
Although electrical stimulation has been widely used as a means of treating neurological deficits, it has several limitations as implantable devices. In electrical stimulation, electrodes have shown degraded electrical performance over time due to glial scar encapsulation. And, under certain circumstances such as magnetic resonance imaging examination, deep brain stimulator can damage the brain tissue by electrode heating. To overcome such limitations, micro magnetic stimulation was suggested as a novel method. One of the strong points of this method is that no direct contact is required between the target tissue and electrode, because induced currents are used for neural stimulation. In this paper, the maximum temperature rise was estimated depending on the stimulation waveforms applied to the coil using FEA simulation.
Keywords
bioelectric potentials; biomagnetism; biomedical MRI; biomedical electrodes; coils; encapsulation; finite element analysis; microelectrodes; micromagnetics; neurophysiology; patient treatment; prosthetics; waveform analysis; FEA; brain tissue damage; coil-based implantable magnetic stimulation; computational study; deep brain stimulator; degraded electrical performance; electrical stimulation; electrode heating; finite element analysis; glial scar encapsulation; induced currents; magnetic resonance imaging examination; micromagnetic stimulation; neural stimulation; neurological deficit treatment; stimulation waveforms; thermal effects; Brain modeling; Coils; Computational modeling; Electric fields; Heating; Magnetic stimulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Neural Engineering (NER), 2013 6th International IEEE/EMBS Conference on
Conference_Location
San Diego, CA
ISSN
1948-3546
Type
conf
DOI
10.1109/NER.2013.6696229
Filename
6696229
Link To Document