• DocumentCode
    663237
  • Title

    Computational study on thermal effects of coil-based implantable magnetic stimulation using finite element analysis

  • Author

    Heejin Park ; Sohee Kim

  • Author_Institution
    Sch. of Mechatron., Gwangju Inst. of Sci. & Technol., Gwangju, South Korea
  • fYear
    2013
  • fDate
    6-8 Nov. 2013
  • Firstpage
    1497
  • Lastpage
    1500
  • Abstract
    Although electrical stimulation has been widely used as a means of treating neurological deficits, it has several limitations as implantable devices. In electrical stimulation, electrodes have shown degraded electrical performance over time due to glial scar encapsulation. And, under certain circumstances such as magnetic resonance imaging examination, deep brain stimulator can damage the brain tissue by electrode heating. To overcome such limitations, micro magnetic stimulation was suggested as a novel method. One of the strong points of this method is that no direct contact is required between the target tissue and electrode, because induced currents are used for neural stimulation. In this paper, the maximum temperature rise was estimated depending on the stimulation waveforms applied to the coil using FEA simulation.
  • Keywords
    bioelectric potentials; biomagnetism; biomedical MRI; biomedical electrodes; coils; encapsulation; finite element analysis; microelectrodes; micromagnetics; neurophysiology; patient treatment; prosthetics; waveform analysis; FEA; brain tissue damage; coil-based implantable magnetic stimulation; computational study; deep brain stimulator; degraded electrical performance; electrical stimulation; electrode heating; finite element analysis; glial scar encapsulation; induced currents; magnetic resonance imaging examination; micromagnetic stimulation; neural stimulation; neurological deficit treatment; stimulation waveforms; thermal effects; Brain modeling; Coils; Computational modeling; Electric fields; Heating; Magnetic stimulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Engineering (NER), 2013 6th International IEEE/EMBS Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1948-3546
  • Type

    conf

  • DOI
    10.1109/NER.2013.6696229
  • Filename
    6696229