DocumentCode
66424
Title
Photoimageable Thick-Film Micro-Coaxial Line for DC-to-Millimeter-Wave Broadband Applications
Author
Daigle, Matthew ; Ke Wu
Author_Institution
Univ. de Sherbrooke, Sherbrooke, QC, Canada
Volume
4
Issue
1
fYear
2014
fDate
Jan. 2014
Firstpage
117
Lastpage
122
Abstract
In this paper, the development of an innovative micro-coaxial line technology is presented and developed for dc-to-millimeter-wave broadband applications. This nondispersive line is fabricated using a simple photoimageable thick-film process. Wave-guiding properties of the developed micro-coaxial line are extracted from 1 to 110 GHz, showing an extremely broadband operation. A single transition from micro-coaxial line to grounded coplanar waveguide is used to cover the entire frequency range available through single vector network analyzer. Passive devices are then demonstrated in the form of a 60 GHz band-pass filter and an 8 dB coupler using vertically coupled lines. Measured results of the demonstrative filter show an excellent agreement with simulated results, which present very good performances with 1.5 dB insertion loss over the frequency band of interest. The broadband coupler exhibits an exceptional multioctave bandwidth (from 20 to 82 GHz) and low loss at 1.5 dB.
Keywords
band-pass filters; coaxial cables; coplanar waveguides; millimetre wave devices; network analysers; DC-to-millimeter-wave broadband applications; band-pass filter; broadband coupler; broadband operation; demonstrative filter; exceptional multioctave bandwidth; frequency range; grounded coplanar waveguide; innovative microcoaxial line technology; insertion loss; nondispersive line; passive devices; photoimageable thick-film microcoaxial line; photoimageable thick-film process; single vector network analyzer; vertically coupled lines; wave-guiding property; Bandwidth; Couplers; Couplings; Dielectric measurement; Dielectrics; Fabrication; Substrates; Band-pass filter; directional coupler; micro-coaxial Line; millimeter-waves; photoimageable thick film;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2013.2265053
Filename
6573324
Link To Document