DocumentCode
664335
Title
A 70W package-integrated class-E Chireix outphasing RF power amplifier
Author
Calvillo-Cortes, David A. ; van der Heijden, Mark P. ; de Vreede, Leo C. N.
Author_Institution
Electron. Res. Lab., Delft Univ. of Technol., Delft, Netherlands
fYear
2013
fDate
2-7 June 2013
Firstpage
1
Lastpage
3
Abstract
A high-power class-E Chireix outphasing RF power amplifier integrated inside a transistor package is described. The optimum class-E loading conditions and the Chireix compensation elements are provided to the active devices by a dedicated ultra-low loss bondwire-based transformer power combiner that enables a very small form factor and low cost. The realized prototype achieves 70.6 W peak power with 73% peak drain-efficiency at 2.3 GHz, and up to 81% peak drain-efficiency for slightly lower power at 2.2 GHz. When operated for maximum power, it reaches 53.5%/43.5% average drain-/total-efficiency for a 9.6 dB PAR W-CDMA signal at 2.3 GHz with low ACLR1/2 levels (-49/-56 dBc after memory-less DPD).
Keywords
power combiners; radiofrequency power amplifiers; efficiency 43.5 percent; efficiency 53.5 percent; efficiency 73 percent; frequency 2.2 GHz; frequency 2.3 GHz; high power class E Chireix outphasing RF power amplifier; optimum class E loading conditions; package integrated class E Chireix outphasing RF power amplifier; power 70 W; power 70.6 W; transistor package; ultra low loss bondwire based transformer power combiner; Gallium nitride; Microwave circuits; Multiaccess communication; Peak to average power ratio; Radio frequency; Spread spectrum communication; Transistors; Chireix combiner; Outphasing transmitter; base station; bondwire; class-E; power amplifier; transformer;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location
Seattle, WA
ISSN
0149-645X
Print_ISBN
978-1-4673-6177-4
Type
conf
DOI
10.1109/MWSYM.2013.6697341
Filename
6697341
Link To Document