DocumentCode :
664341
Title :
A package-integrated 50W high-efficiency RF CMOS-GaN class-E power amplifier
Author :
van der Heijden, Mark P. ; Acar, Mustafa ; Maroldt, S.
Author_Institution :
NXP Semicond., Eindhoven, Netherlands
fYear :
2013
fDate :
2-7 June 2013
Firstpage :
1
Lastpage :
3
Abstract :
A 50 W CMOS-GaN class-E power amplifier in a package is presented. The class-E operated GaN HEMT power bar switches are driven by a high speed, high voltage CMOS power bar driver chip, implemented in a standard 65 nm process technology. The proposed switch-mode power amplifier demonstrates 76% line-up efficiency and 85% GaN drain efficiency at 2.14 GHz, including the losses of the matching network in the package. To the authors knowledge this is the world´s first package-integrated CMOS-GaN power amplifier that could enable digital transmitter architectures based on true switch-mode power amplifier blocks.
Keywords :
CMOS integrated circuits; III-V semiconductors; gallium compounds; high electron mobility transistors; power amplifiers; wide band gap semiconductors; CMOS power bar driver chip; GaN; GaN HEMT power bar switches; GaN drain efficiency; RF CMOS-GaN; class-E power amplifier; digital transmitter architecture; frequency 2.14 GHz; line-up efficiency; package-integrated power amplifier; power 50 W; switch-mode power amplifier block; CMOS integrated circuits; Gallium nitride; HEMTs; Power amplifiers; Power generation; Radio frequency; Standards; Base station; CMOS; GaN; class-E; digital transmitter; drain efficiency; switch mode power amplifier;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location :
Seattle, WA
ISSN :
0149-645X
Print_ISBN :
978-1-4673-6177-4
Type :
conf
DOI :
10.1109/MWSYM.2013.6697347
Filename :
6697347
Link To Document :
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