Title :
Random-space dimensionality reduction scheme for expedient analysis of microwave structures with manufacturing variability
Author :
Ochoa, Juan ; Cangellaris, Andreas
Author_Institution :
Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
A dimensionality reduction scheme is presented for the expedient statistical analysis of microwave structures exhibiting manufacturing variability in geometric and electrical parameters. In the proposed approach, the computational complexity of the high-dimensional random space that is often necessary to describe the stochastic electromagnetic boundary-value problem is mitigated by employing a principal component analysis with sensitivity assessment in combination with an adaptive sparse grid colocation scheme. The proposed method exploits the inherent dependencies between parameters to reduce the number of simulations needed to extract the statistics of desired output response parameters. The attributes of the method are demonstrated through the analysis of the cross talk between the wires of a coupled stripline transmission line structure.
Keywords :
boundary-value problems; computational complexity; microwave circuits; principal component analysis; stochastic processes; strip line circuits; transmission line theory; adaptive sparse grid colocation scheme; computational complexity; coupled stripline transmission line structure; cross talk analysis; electrical parameters; expedient analysis; expedient statistical analysis; geometric parameters; high-dimensional random space; manufacturing variability; microwave structures; output response parameters; principal component analysis; random-space dimensionality reduction scheme; sensitivity assessment; stochastic electromagnetic boundary-value problem; Adaptation models; Computational modeling; Principal component analysis; Reduced order systems; Sensitivity; Stochastic processes; Uncertainty; Adaptive sparse grid colocation; principal component analysis; sensitivity analysis; statistical variability;
Conference_Titel :
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4673-6177-4
DOI :
10.1109/MWSYM.2013.6697372