DocumentCode :
66445
Title :
Electric Current-Induced Mass Flow in Very Thin Infinite Metallic Films
Author :
Talukder, Santanu ; Kumar, Pranaw ; Pratap, Rudra
Author_Institution :
Center for Nano Sci. & Eng., Indian Inst. of Sci., Bangalore, India
Volume :
60
Issue :
9
fYear :
2013
fDate :
Sept. 2013
Firstpage :
2877
Lastpage :
2883
Abstract :
This paper reports on the mass transport behavior of infinitely extended, continuous, and very thin metallic films under the influence of electric current. Application of direct current of high densities (> 108 A/m2) results in visible melting of thin film at only one of the electrodes, and the melt then flows towards the other electrode in a circularly symmetric fashion forming a microscale ring pattern. For the two tested thin film systems, namely Cr and Al, of thicknesses ranging from 4 to 20 nm, the above directional flow consistently occurred from cathode to anode and anode to cathode, respectively. Furthermore, application of alternating electric current results in flow of the liquid material from both the electrodes. The dependence of critical flow behavior parameters, such as flow direction, flow velocity, and evolution of the ring diameter, are experimentally determined. Analytical models based on the principles of electromigration in liquid-phase materials are developed to explain the experimental observations.
Keywords :
electromigration; metallic thin films; Al; Cr; anode; cathode; critical flow behavior parameter; directional flow; electric current-induced mass flow; electromigration; flow direction; flow velocity; liquid-phase material; mass transport behavior; microscale ring pattern; size 4 nm to 20 nm; thin infinite metallic film; visible melting; Electrodes; Electromigration; Liquids; Loading; Metals; Probes; Electromigration; liquid electromigration; reliability; very thin films;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2273949
Filename :
6573327
Link To Document :
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