• DocumentCode
    664464
  • Title

    Micromachined filters in multilayer technology for on-board communication systems in Ka-band

  • Author

    Pelliccia, Luca ; Farinelli, P. ; Sorrentino, Roberto

  • Author_Institution
    RF Microtech Srl, Perugia, Italy
  • fYear
    2013
  • fDate
    2-7 June 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A new concept for compact and low-loss Ka-band micromachined bandpass filters for next generation on-board communications is presented which combines micromachined cavities with multilayer technology on silicon. The resonator consists of a gold-plated micromachined shielding cavity with a longitudinal 20 μm thick gold-plated silicon membrane. The membrane is short-circuited at both anchored ends and it operates as a λ/2 TEM line resonator. The footprint of a single resonator is reduced by more than 50% with respect to conventional micromachined cavities using the TE101 resonant mode. The measurements of single transmission-type resonators are in very good agreement with the full-wave simulations, demonstrating a high filter robustness to process tolerance. The expected unloaded Q of the resonators for 500 μm thick layers is 600, and the measured value is above 500. Qs above 1000 are feasible with the available technology by simply increasing the number and the thickness of the silicon layers. A 4th order pseudo-elliptic filter at 30 GHz (FBW = 1.7%) has been designed and is under fabrication.
  • Keywords
    band-pass filters; micromachining; micromechanical resonators; microwave filters; microwave resonators; next generation networks; Ka band; frequency 30 GHz; full wave simulations; gold plated micromachined shielding cavity; gold plated silicon membrane; micromachined bandpass filters; micromachined cavities; multilayer technology; on board communication systems; pseudoelliptic filter; single transmission type resonators; size 20 mum; size 500 mum; Band-pass filters; Cavity resonators; Couplings; Microwave filters; Resonant frequency; Resonator filters; Silicon; Micromachined; bandpass filter; high-Q; multilayer; surface mountable;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
  • Conference_Location
    Seattle, WA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-6177-4
  • Type

    conf

  • DOI
    10.1109/MWSYM.2013.6697473
  • Filename
    6697473