• DocumentCode
    664545
  • Title

    Bi-layered substrate integrated waveguide Wilkinson power divider/combiner

  • Author

    Djerafi, Tarek ; Hammou, D. ; Tatu, Serioja Ovidiu ; Wu, Kaijie

  • Author_Institution
    Inst. Nat. de la Rech. Sci., Energie Mater. et Telecommun. Montreal, Montreal, QC, Canada
  • fYear
    2013
  • fDate
    2-7 June 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper proposes a novel substrate integrated waveguide (SIW) power divider and combiner based on a modified Wilkinson architecture. This topology allows SIW waveguide to use conserving then shielding quality. The proposed design consists on a ring circuit of 1.5 λg length with three waveguide accesses. The optimal configuration of inserting the resistance is studied. A bi-layered circuit is fabricated with standard PCB process. Output return loss and isolation measurement results better than -10 dB are observed across around 25 % bandwidth over X-band (8.5 GHz to 11 GHz).
  • Keywords
    network topology; power combiners; power dividers; printed circuits; substrate integrated waveguides; bi-layered substrate integrated waveguide Wilkinson power divider; frequency 8.5 GHz to 11 GHz; isolation measurement; modified Wilkinson architecture; output return loss; power combiner; ring circuit; shielding quality; standard PCB process; Loss measurement; Microstrip; Power dividers; Propagation losses; Resistance; Substrates; Substrate integrated waveguide (SIW); power divider/combiner;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
  • Conference_Location
    Seattle, WA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-6177-4
  • Type

    conf

  • DOI
    10.1109/MWSYM.2013.6697556
  • Filename
    6697556