DocumentCode
664545
Title
Bi-layered substrate integrated waveguide Wilkinson power divider/combiner
Author
Djerafi, Tarek ; Hammou, D. ; Tatu, Serioja Ovidiu ; Wu, Kaijie
Author_Institution
Inst. Nat. de la Rech. Sci., Energie Mater. et Telecommun. Montreal, Montreal, QC, Canada
fYear
2013
fDate
2-7 June 2013
Firstpage
1
Lastpage
3
Abstract
This paper proposes a novel substrate integrated waveguide (SIW) power divider and combiner based on a modified Wilkinson architecture. This topology allows SIW waveguide to use conserving then shielding quality. The proposed design consists on a ring circuit of 1.5 λg length with three waveguide accesses. The optimal configuration of inserting the resistance is studied. A bi-layered circuit is fabricated with standard PCB process. Output return loss and isolation measurement results better than -10 dB are observed across around 25 % bandwidth over X-band (8.5 GHz to 11 GHz).
Keywords
network topology; power combiners; power dividers; printed circuits; substrate integrated waveguides; bi-layered substrate integrated waveguide Wilkinson power divider; frequency 8.5 GHz to 11 GHz; isolation measurement; modified Wilkinson architecture; output return loss; power combiner; ring circuit; shielding quality; standard PCB process; Loss measurement; Microstrip; Power dividers; Propagation losses; Resistance; Substrates; Substrate integrated waveguide (SIW); power divider/combiner;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location
Seattle, WA
ISSN
0149-645X
Print_ISBN
978-1-4673-6177-4
Type
conf
DOI
10.1109/MWSYM.2013.6697556
Filename
6697556
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